Instant, multi-scale dry transfer printing by atomic diffusion control at heterogeneous interfaces
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Transfer printing is a technique that integrates heterogeneous materials by readily retrieving functional elements from a grown substrate and subsequently printing them onto a specific target site. These strategies are broadly exploited to construct unusual forms of heterogeneously integrated electronic devices. A typical wet transfer printing method involves the selective removal of a sacrificial layer between the substrate and device layer through wet chemical etching. However, wet transfer printing exhibits limitations related to unwanted displacement and shape distortion of the prepared device due to uncontrollable fluid movement as well as to slow chemical diffusion. In this study, a dry transfer printing technique that allows reliable and instant release of devices by exploiting the difference in the degrees of thermal expansion between adjacent materials is demonstrated, and associated computational studies are conducted to investigate the fundamental mechanisms of the dry transfer printing process. Extensive exemplary demonstrations of multi-scale, sequential wet-dry, circuit-level and biological topography-based transfer printing demonstrate the potential of this technique for many other emerging applications in modern electronics that have not been achieved through conventional wet transfer printing over the past few decades.